| 摘要 |
A semiconductor device manufacturing apparatus is provided to reduce remarkably an upper ring replacing cost by replacing a damaged portion alone of an upper ring using an improved upper ring structure composed of an inner ring and an outer ring. A semiconductor device manufacturing apparatus comprises a process chamber(110), upper and lower electrodes(130) for generating a predetermined plasma in the process chamber, a lower ring(150) for enclosing the lower electrode and an upper ring. The upper ring(140) is arranged in the process chamber to enclose the upper electrode. The upper ring is composed of an outer ring(144) and an inner ring(142) between the outer ring and the upper electrode.
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