发明名称 |
Part mounting apparatus and part mounting method |
摘要 |
A component mounting apparatus and a component mounting method which improve accuracy and a rate of placement of components onto a circuit-formed member. A component sucked by a suction nozzle is recognized at a component recognizing position, a deviation of the component from a normal suction status is determined on the basis of component recognition information obtained from this recognition of the component, and a velocity of conveyance of the component for a period of time following the recognition of the component and preceding placement of the component is controlled on basis of a magnitude of the deviation. By this control, the accuracy and rate of placement of components onto the circuit-formed member can be improved.
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申请公布号 |
US7185422(B2) |
申请公布日期 |
2007.03.06 |
申请号 |
US20040501218 |
申请日期 |
2004.07.12 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
SAKAI KAZUNOBU;NAKASHIMA MAKOTO;HIRAI WATARU;ISHITANI YASUYUKI |
分类号 |
H05K3/30;B23P19/00;H01L21/50;H01L21/52;H05K13/04;H05K13/08 |
主分类号 |
H05K3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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