发明名称 Part mounting apparatus and part mounting method
摘要 A component mounting apparatus and a component mounting method which improve accuracy and a rate of placement of components onto a circuit-formed member. A component sucked by a suction nozzle is recognized at a component recognizing position, a deviation of the component from a normal suction status is determined on the basis of component recognition information obtained from this recognition of the component, and a velocity of conveyance of the component for a period of time following the recognition of the component and preceding placement of the component is controlled on basis of a magnitude of the deviation. By this control, the accuracy and rate of placement of components onto the circuit-formed member can be improved.
申请公布号 US7185422(B2) 申请公布日期 2007.03.06
申请号 US20040501218 申请日期 2004.07.12
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 SAKAI KAZUNOBU;NAKASHIMA MAKOTO;HIRAI WATARU;ISHITANI YASUYUKI
分类号 H05K3/30;B23P19/00;H01L21/50;H01L21/52;H05K13/04;H05K13/08 主分类号 H05K3/30
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