发明名称 Processing pad assembly with zone control
摘要 An electrochemical mechanical processing station having a zoned polishing pad assembly is provided. The zoned polishing pad assembly includes a conductive layer coupled to an upper layer having a non-conductive processing surface. At least two zones of different current permeability are defined across the processing surface of the upper layer. Each zone is defined by an attribute of the upper layer.
申请公布号 US7186164(B2) 申请公布日期 2007.03.06
申请号 US20030727774 申请日期 2003.12.03
申请人 APPLIED MATERIALS, INC. 发明人 MANENS ANTOINE P.
分类号 B24B49/00;B24B37/04;C25D7/12;C25D17/14;C25F7/00 主分类号 B24B49/00
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