| 摘要 |
Embodiments of the invention include a stacked board-on-chip (BOC) package having a mirroring structure and a dual inline memory module (DIMM) on which the stacked BOC package is mounted. A bottom surface of a first semiconductor chip faces a bottom surface of a second semiconductor chip. An interposer electrically connects first and second packages, respectively comprising the first and second semiconductor chips, to each other. The DIMM is obtained by electrically connecting BOC packages to each other on upper and lower substrates of a printed circuit board. Since a height of the stacked BOC packages is greater than a height of a conventional stacked BOC package, the DIMM has a minimum stub length and an optimal topology. Hence, the DIMM can have a signal with excellent fidelity by reducing a load upon a signal line, and installation or wiring of components within the DIMM 300 requires less effort. |
