| 摘要 |
<p>Disclosed is a silicon based condenser microphone comprising a metal case which is inserted into the inserting hole of the main PCB and has a closed bottom side and a board which is broader than the metal case. The board is formed with a sound hole on the central portion thereof and mounted with a MEMS microphone chip and an ASIC chip having an electric pressure pump and a buffer IC. The board is formed with a connecting pattern for bonding with the metal case so that the metal case is bonded to the connecting pattern. The microphone further comprises connecting terminals which are formed on a part side of the board which is mounted with the metal case to connect with the connecting pads of the main PCB. Thus, the total height of the assembly after mounting the microphone of the present invention is lower than that of the conventional assembly, thereby efficiently saving a part space within the product.</p> |
