发明名称 |
EPI wafer and method of making the same |
摘要 |
A method including forming alignment marks in an upper surface of a semiconductor wafer; selectively depositing a mask over the alignment marks leaving portions of the upper surface exposed; depositing an epitaxial layer over the exposed portions of the upper surface; and thereafter removing the mask. |
申请公布号 |
US2007048974(A1) |
申请公布日期 |
2007.03.01 |
申请号 |
US20050212969 |
申请日期 |
2005.08.25 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
CHOU HSUEH-LIANG;HUANG DE-FANG |
分类号 |
H01L21/20;H01L21/36 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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