摘要 |
The invention relates to a method, according to which a base is provided, with a series of layers for an LED chip, suitable to emit electromagnetic radiation. A cover layer is applied to at least one main surface of the base. At least one cavity is introduced into the cover layer, the cavity being completely or partially filled with a luminescence conversion material. The luminescence conversion material uses at least one fluorescent substance. The invention also relates to a method, according to which the cover layer comprises photostructurable material and at least one fluorescent substance, so that it acts as luminescence conversion material and can be directly photostructured. Also disclosed are LED chips that can be produced using said method. |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH;BRUNNER, HERBERT;EISSLER, DIETER;FISCHER, HELMUT;GUENTHER, EWALD, KARL, MICHAEL;HEINDL, ALEXANDER |
发明人 |
BRUNNER, HERBERT;EISSLER, DIETER;FISCHER, HELMUT;GUENTHER, EWALD, KARL, MICHAEL;HEINDL, ALEXANDER |