| 摘要 |
<P>PROBLEM TO BE SOLVED: To strengthen an adhesion between a first external terminal 2 and a resin 5, and to reduce a risk of an exfoliation of the resin 5 from the terminal 2. <P>SOLUTION: A semiconductor device is manufactured by the steps of connecting the lower surface of a semiconductor element 1 with the terminal 2; connecting the upper surface of the element 1 with a second external terminal 3 through an internal terminal 4; sealing the element 1, the terminal 4, a part of the terminal 2, and a part of the terminal 3 by the resin 5; arranging the lower surface of the terminal 2, the lower surface of the terminal 3, and the lower surface of the resin 5 on the same plane; making the lower surface of the terminal 2 smaller than the upper surface of the terminal 2; and forming a step comprising convex parts 2a1, 2b1, 2c1 and concave parts 2a2, 2b2, 2c2 on the sides 2a, 2b, 2c of the terminal 2. The further projections 2a1a, 2a1b are partially formed on the convex part 2a1 of the step on the side 2a of the terminal 2 at the side of the terminal 3. <P>COPYRIGHT: (C)2007,JPO&INPIT |
