发明名称 ELECTROLESS PLATING APPARATUS AND PLATING SOLUTION
摘要 PROBLEM TO BE SOLVED: To form a plated film having adequate characteristics and reliability by inhibiting a plating solution from deteriorating. SOLUTION: This electroless plating apparatus comprises: a plating-solution circulation system 350 provided with a plating-solution supply pipe 308 for supplying the plating solution in a plating solution storage tank 302 to a plating tank 200, and with a plating-solution-recovering pipe 310 for returning the plating solution in the plating tank 200 to the plating solution storage tank 302; and heat insulation parts 272a, 272b, 352 and 356 for inhibiting the fall of a temperature of the plating solution in the whole plating-solution circulation system 350. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007051346(A) 申请公布日期 2007.03.01
申请号 JP20050237894 申请日期 2005.08.18
申请人 EBARA CORP 发明人 SAIJO YASUHIKO;KOBA TAKASHI;TSUJINO JUNICHIRO
分类号 C23C18/31;C23C18/16;C23C18/32 主分类号 C23C18/31
代理机构 代理人
主权项
地址