Production unit for semiconductor device and devices has chip test section, information memory, template printer and print head and chip coordinate recognition section and control section

摘要

A production unit for a semiconductor device comprises a wafer test section (100) to determine the properties of chips on a wafer and a template to trim chips according to the test data. There is a test data memory (120), a display pattern print section (11) for each chip and a print head (111) that injects at least one conductor, insulator and boundary processing solution. A chip coordinate recognition section (112) and control section (113) control the print head based on the test data, memory and chip coordinate. Independent claims are also included for the following: (A) A device as above; (B) An IGBT chip: (C) A non-volatile memory; (D) An integrated high-voltage circuit;and (E) Production processes for the above.