发明名称 Method of sputter depositing an alloy on a substrate
摘要 An improved planetary sputter deposition method for sputter depositing an alloy on a substrate wherein the sputter deposited amount, or thickness, of a specific material of the alloy can be controlled so that different substrates can be provided with an alloy having a different composition, i.e. having different percentages of the same materials, thus, reducing the costs of stockpiling multiple alloy targets. The method generally includes providing a substrate and a plurality of targets with each of the plurality of targets being composed of one or more magnetic materials. The targets are sputtered, in sequence, to deposit each of the materials of the plurality of targets on the substrate to provide at least one laminate defining an alloy.
申请公布号 US2007045102(A1) 申请公布日期 2007.03.01
申请号 US20050209907 申请日期 2005.08.23
申请人 VEECO INSTRUMENTS INC. 发明人 LEE CHIH-LING;DEVASAHAYAM ADRIAN;MAO MING;HU CHIH-CHING;IP VINCENT;SFERLAZZO PIERO
分类号 C23C14/00 主分类号 C23C14/00
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