发明名称 Semiconductor substrate, semiconductor device, manufacturing method thereof, and method for designing semiconductor substrate
摘要 A semiconductor substrate, includes: a capacitance-adjusting semiconductor layer which is disposed in a predetermined region on a semiconductor substrate material and which is sufficiently thick and has a lower impurity density than that of the semiconductor substrate material; a first insulation film disposed on the capacitance-adjusting semiconductor layer; and a body layer made of a semiconductor disposed on the first insulation film.
申请公布号 US2007045657(A1) 申请公布日期 2007.03.01
申请号 US20060492607 申请日期 2006.07.24
申请人 SEIKO EPSON CORPORATION 发明人 KANEMOTO KEI
分类号 H01L29/74 主分类号 H01L29/74
代理机构 代理人
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