发明名称 WIRING BOARD ASSEMBLY, WIRING STRUCTURE AND WIRING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring board assembly superior in the productivity, a wiring structure and a wiring method for increasing the productivity of the wiring board assembly. <P>SOLUTION: The wiring board assembly is provided with a wiring board 31, and an electric wire 6 discharged from a head 4 of a wiring apparatus 1 relatively moved on the wiring board 31 along a predetermined wiring path of the wiring board 31 and wired on the wiring path. The wiring board 31 includes at least one accommodation section 30 having a pair of side walls 32b and partially accommodating the electric wire 6 between the side walls 32b. A pair of the side walls 32b are formed so as to reduce a mutual distance toward an upper end, maintain a distance W smaller than a diameter D of the electric wire 6 between nearest tips 34 at the upper end, expand the distance between the tips 34 and be elastically deformed. A distance of the tips 34 from the head 4 is less than 1/2 of the diameter D of the electric wire 6. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007053848(A) 申请公布日期 2007.03.01
申请号 JP20050236705 申请日期 2005.08.17
申请人 YAZAKI CORP 发明人 ARAKI MAMORU
分类号 H02G3/16 主分类号 H02G3/16
代理机构 代理人
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