| 摘要 |
A method for fabricating a cover plate of an organic electroluminescent device comprising the following steps is provided. First, a substrate is provided, wherein the substrate has a bonding region. Then, a liquid-state desiccant layer is formed on the substrate, wherein the liquid-state desiccant layer is surrounded by the bonding region. Next, the liquid-state desiccant layer is cured to form a desiccant layer. Then, the bonding region of the substrate is cleaned. As mentioned above, the contaminants on the bonding region can be drastically reduced. Moreover, an organic electroluminescent device and a cover plate thereof are also provided.
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