发明名称 Method and apparatus for fluid polishing
摘要 In a fluid polishing method for processing a fine aperture by slurry 7, the slurry is supplied from a cylinder 2 a in a slurry flow rate target process until the flow rate increases to a target value of a slurry feed flow rate. When the flow rate reaches the target flow-rate, the cylinder is stopped and switched to another cylinder 2 b and the operation fluid flow rate of the fine aperture is thereafter measured. In a metering process, to be executed next, a necessary processing time is calculated on the basis of the operation fluid flow rate and polishing is carried out for a necessary processing time by another cylinder 2 b. Another cylinder is then stopped and switched and the operation fluid flow rate is measured. In this way, the metering process is repeated until the operation fluid flow rate reaches a predetermined value. In each process, the supply of the slurry is not interrupted.
申请公布号 US2007049178(A1) 申请公布日期 2007.03.01
申请号 US20060509749 申请日期 2006.08.24
申请人 发明人 OOKA YASUHITO;KATO SHINICHI;KIMURA KAZUNARI;KATO SHIGEYA
分类号 B24B1/00 主分类号 B24B1/00
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