DEVICE AND METHOD FOR MEASURING VIEW ANGLE OF WAFER LEVEL LED

摘要

A method for measuring the view angle of a wafer-level LED is provided to measure a packaged wafer-level LED or wafer-level LED in which an LED is attached to a wafer by aligning a wafer-level LED with a photodiode and by applying power to the LED. A wafer(30) is positioned on a chuck(40) installed in a prober. The chuck is aligned with the rotation chuck of an arm(10). A probe pin(20) comes in contact with a wafer-level LED(31) and power is applied to the probe pin so that the wafer-level LED or a packaged wafer-level LED emits light. The arm is rotated by the rotation of a motor(50), and the view angle of the wafer-level LED or the packaged wafer-level LED is measured by a photodiode(11) attached to the arm.