发明名称 |
ADHERING APPARATUS AND ADHERING METHOD |
摘要 |
<p>A sticking apparatus 10 includes a sticking table 11 supporting a semiconductor wafer W and a sticking unit 12 sticking a heat sensitive adhesive sheet S to the semiconductor wafer W. The sticking unit 12 includes a peeling section that, when paying out a raw sheet L having adhesive sheet S laminated to one side face of a release liner PS, peels off the release liner PS and the adhesive sheet S and a sheet preliminary peeling unit 40 provided at an upstream side of the peeling section in a pay-out direction of the raw sheet. The sheet preliminary peeling unit 40 includes a moving member 50 that moves to and from in a state of being pinched between the release liner PS and the adhesive sheet S. The preliminarily peeled-off release liner PS and adhesive sheet S are temporarily re-bonded by a temporary re-bonding unit 41, enabling to stick the adhesive sheet S on the wafer W.</p> |
申请公布号 |
EP1758162(A1) |
申请公布日期 |
2007.02.28 |
申请号 |
EP20050737156 |
申请日期 |
2005.04.27 |
申请人 |
LINTEC CORPORATION |
发明人 |
TSUJIMOTO, MASAKI;YOSHIOKA, TAKAHISA;KOBAYASHI, KENJI |
分类号 |
H01L21/68;H01L21/00;H01L21/301;H01L21/52 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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