STRUCTURE AND METHOD FOR CONTACT PADS HAVING AN OVERCOAT-PROTECTED BONDABLE METAL PLUG OVER COPPER-METALLIZED INTEGRATED CIRCUITS,申请号KR20067021792-传众专利搜索

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发明名称	STRUCTURE AND METHOD FOR CONTACT PADS HAVING AN OVERCOAT-PROTECTED BONDABLE METAL PLUG OVER COPPER-METALLIZED INTEGRATED CIRCUITS
摘要
申请公布号	KR20070022032(A)	申请公布日期	2007.02.23
申请号	KR20067021792	申请日期	2006.10.20
申请人		发明人
分类号	H01L21/60	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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