发明名称 ELECTROFORMING MOLD, ELECTROFORMED COMPONENT AND METHOD OF PRODUCING ELECTROFORMED COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide an electroforming mold from which a resist is easily released, a method of manufacturing the same, an electroformed component prevented from damage due to high temperature heating and a method of manufacturing the electroformed component. SOLUTION: The electroforming mold comprises a conductive layer 2 formed on the upper surface of a substrate 1 and the resist 3 having a mold space 5 where the electroformed component 20 is formed. The resist 3 or the electroformed component 20 is expanded or contracted by heating or cooling the electroforming mold. Stress is applied to the resist 3 by the expansion or the contraction of the resist 3 or the electroformed component 20 to cause crack on the resist 3 to peel off the resist 3 or the electroformed component 20. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007046109(A) 申请公布日期 2007.02.22
申请号 JP20050231846 申请日期 2005.08.10
申请人 SEIKO INSTRUMENTS INC 发明人 NIWA TAKASHI;NAKAJIMA MASAHIRO
分类号 C25D1/20 主分类号 C25D1/20
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