发明名称 Manufacturing method of semiconductor device and substrate processing apparatus
摘要 To provide a manufacturing method of a semiconductor device and a substrate processing apparatus capable of easily controlling a nitrogen concentration distribution in a film containing a metal atom and a silicon atom, and manufacturing a high quality semiconductor device. The method comprises a step of forming a film containing the metal atom and the silicon atom on a substrate 30 in a reaction chamber 4, and performing a nitriding process for the film, wherein the film is formed by changing a silicon concentration at least in two stages in the step of forming a film.
申请公布号 US2007042581(A1) 申请公布日期 2007.02.22
申请号 US20050574571 申请日期 2005.01.21
申请人 HITACHI KOKUSAL ELECTRIC INC. 发明人 SANO ATSUSHI;HORII SADAYOSHI;ITATANI HIDEHARU;ASAI MASAYUKI
分类号 H01L21/24;C23C16/34;C23C16/44;C23C16/455;H01L21/316;H01L21/318 主分类号 H01L21/24
代理机构 代理人
主权项
地址
您可能感兴趣的专利