| 摘要 |
A method of providing a printed circuit board, a printed circuit board formed according to the method, and a system comprising the printed circuit board. The method comprises: providing a microelectronic substrate; providing a via-defining substrate by providing via openings in the substrate using laser irradiation; providing a laser activatable film on the via-defining substrate; and providing interconnects on the via-defining substrate. Providing interconnects comprises providing a patterned build-up layer on the via-defining substrate comprising exposing the laser activatable film to laser irradiation to selectively activate portions of the film according to a predetermined interconnect pattern; and metallizing the patterned build-up layer according to the predetermined interconnect pattern to yield the interconnects to provide the printed circuit board.
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