| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a composite multilayer printed wiring board wherein the deterioration of the migration resistance of an internal layer flex board is prevented. <P>SOLUTION: Rigid boards 50 are laminated on both sides of the end of the flex board 20 through interlayer adhesive layers 40, respectively. The Young's modulus of an insulating substrate 51 in the rigid board 50 is set equivalent to or less than that of a flexible resin film 21 of the flex board 20, so that the stresses remaining in the interlayer adhesive layer 40 and an adhesive layer 32 are prevented after the press cure. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
