| 摘要 |
PROBLEM TO BE SOLVED: To improve long-term reliability of metal wiring of a wiring board by preventing migration that is caused by flow of current and heat. SOLUTION: The configuration of the wiring board as well as that of the structural member comprising the metal layer feature the following: In the wiring board, a wiring of metal is formed on an insulating substrate. A layer consisting of inorganic particles and a binder is formed on the surface of the wiring; The inorganic particle is formed from any of silicon oxide, aluminum oxide, or titanium oxide while the binder is formed from silicon compound. COPYRIGHT: (C)2007,JPO&INPIT
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