发明名称 HOLDING STRUCTURE OF IMAGE SENSOR PACKAGE, AND LENS UNIT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an easy-to-assemble holding structure of an image sensor package in which heat can be dissipated efficiently from a solid state image sensor, and to provide a lens unit employing that holding structure, and a digital camera for attaching that lens unit. <P>SOLUTION: In the lens unit 4, a holding member 23, a mounting substrate 24, an image sensor package 22, and a heat transfer member 25 are incorporated sequentially in the rear end of a lens barrel 20 holding a photography lens, and a lens side mount 8 is secured to the lens barrel 20 by means of screws. The image sensor package 22 is fitted in a recess 38 of the holding member 23, and a contact 34 of the image sensor package 22 is connected with a connection terminal 41. When the lens side mount 8 is secured to the lens barrel 20, a seating portion 52 presses the heat transfer member 25 forward and the abutment surface 25a of the heat transfer member 25 adheres substantially entirely to the back 22a of the image sensor package 22. Consequently, the image sensor package 22 is positioned in the recess 38 and the heat transfer member 25 conducts heat generated from the a solid state image sensor 33 to the lens side mount 8 where heat is dissipated efficiently. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007049369(A) 申请公布日期 2007.02.22
申请号 JP20050231013 申请日期 2005.08.09
申请人 FUJIFILM HOLDINGS CORP 发明人 TOKIWA KENTARO
分类号 H04N5/225;G02B7/02;H01L27/14;H04N5/376;H04N101/00 主分类号 H04N5/225
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