发明名称 METAL PLATE JOINING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a metal plate joining method capable of adequately joining the entire joining surface without leaving any non-joined portion when joining metal plates with each other by using a nano-metal paste. SOLUTION: In this metal plate joining method, when performing the surface-joining between metal plates by using a nano-metal paste having a mixed composition consisting of metal nano particles, an organic dispersant for suppressing coagulation of the metal nano particles at normal temperature, a dispersant trapping material to be reacted with the organic dispersant when being heated, and a volatile organic component which traps a reactive substance with the dispersant and the dispersant trapping material and vaporizes the reactive substance by the heating, the nano metal paste is applied at normal temperature to the uniform thickness on the joining surface of one metal plate to be joined. In the next pre-heating process, the surface of the applied nano metal paste is separated from the metal plate to be joined on the counter side, and heated to vaporize the organic components of the nano metal paste. In the pressurizing and joining process continuous to the pre-heating process, the pressure is applied between the metal plates after the metal plate to be joined on the counter side overlaps the applied surface of the nano metal paste, and the nano metal particles, and the nano metal particles and the metal plate to be joined are bonded/welded to each other. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007044754(A) 申请公布日期 2007.02.22
申请号 JP20050233948 申请日期 2005.08.12
申请人 FUJI ELECTRIC DEVICE TECHNOLOGY CO LTD 发明人 SHINNO FUMITATSU
分类号 B23K20/16;B23K20/26;B23K35/22;B23K101/40;H01L23/373;H01L23/40 主分类号 B23K20/16
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