| 摘要 |
PROBLEM TO BE SOLVED: To improve the process rate (test speed) of wafer inspection. SOLUTION: The wafer surface irradiation device comprises a first flash light source 21 for emitting a first light beam, a second flash light source 22 for emitting a second light beam, a deflection optical system 30, and a control means. The flash light sources 21 and 22 are arranged so as to emit light toward the deflection optical system 30, the control means makes the flash light sources 21 and 22 alternately emit light at a predetermined frequency, and the deflection optical system 30 deflects the first and second light beams to a common optical path set on the front side of the wafer. COPYRIGHT: (C)2007,JPO&INPIT
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