DEVICE AND METHOD FOR INSPECTING SURFACE OF WAFER

摘要

PROBLEM TO BE SOLVED: To provide a device and a method for inspecting the surface of a wafer. SOLUTION: The device for inspecting the surface of the wafer has a filter device provided with: an illumination means for illuminating the image area of the wafer by at least one wideband spectrum; an optical image means having a detector for multicolor imaging of the image area of the wafer based on the illumination; and an image means for selecting a plurality of narrowband spectrums. The method is used for inspecting the surface of the wafer and has a step in which a plurality of the narrowband spectrums are averaged into a common strength range, the image area of the wafer is illuminated by at least one wideband spectrum, and a plurality of the narrowband spectrums are reflected from the image area by using the illumination. COPYRIGHT: (C)2007,JPO&INPIT