| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To widely apply external air to electronic components, and to efficiently cool electronic components. <P>SOLUTION: This electronic component cooling structure is provided with an air intake 5 mounted on the side face of a case body 1 of a computer 100, and equipped with an air intake front part 40a and an air intake back part 40b for shunting air flowing from one or two air intake ports, wherein at least the front part 40a or the back part 40b is arranged so as to face hard disks 24a to 24d or a heat sink 26. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
