发明名称 Exposure method and device for forming patterns on printed wiring board
摘要 An optical exposure method and a device are used for forming patterns on a printed board wiring or semiconductor board. A single exposing region of a surface to be exposed is irradiated with a plurality of optical beams having different irradiating areas and different scanning pitches, such as, a peripheral area is irradiated with an optical beam having a smaller irradiating area and an inner area is irradiated with an optical beam having a larger irradiating area.
申请公布号 US7179584(B2) 申请公布日期 2007.02.20
申请号 US20020328449 申请日期 2002.12.23
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 SEKIGAWA KAZUNARI;AKAGAWA MASATOSHI
分类号 G03F7/30;G03F7/20;H01L21/027;H05K3/00 主分类号 G03F7/30
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