| 发明名称 |
Chip-scale schottky device |
| 摘要 |
A chip-scale schottky package which has at least one cathode electrode and at least one anode electrode disposed on only one major surface of a die, and solder bumps connected to the electrode for surface mounting of the package on a circuit board.
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| 申请公布号 |
US2007034984(A1) |
申请公布日期 |
2007.02.15 |
| 申请号 |
US20060582755 |
申请日期 |
2006.10.18 |
| 申请人 |
INTERNATIONAL RECTIFIER CORPORATION |
发明人 |
SKOCKI SLAWOMIR |
| 分类号 |
H01L27/095;H01L23/48;H01L23/485;H01L29/417;H01L29/872 |
主分类号 |
H01L27/095 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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