发明名称 SUBSTRATE TREATMENT DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a deposition device and a semiconductor device which has a growing speed of the high selection epitaxial growth of Si or SiGe by reducing a temperature gradient of a heater, in a substrate treatment device supplying gas through a nozzle. <P>SOLUTION: The substrate treatment device which selectively grows a silicone epitaxial film on a silicone substrate is provided with a treatment chamber 12, a heating device 4 having a plurality of division zones that can heat the substrate stored in the processing chamber 12 and can perform different heating control and a gas supply system 8 supplying a silicone system gas and an etching system gas into the treatment chamber 12. The gas supply system 8 is provided with a plurality of gas supply members supplying the silicone system gases or the etching system gases to a plurality of different places in the treatment chamber 12. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007042671(A) 申请公布日期 2007.02.15
申请号 JP20050221902 申请日期 2005.07.29
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 YOKOGAWA TAKASHI;HASHIBA SHIYOUSHIYO;YAMAMOTO KATSUHIKO;OGAWA YASUHIRO
分类号 H01L21/205 主分类号 H01L21/205
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