| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve moistureproof reliability by making adhesiveness between an insulating film, component made of copper and a sealing resin firm. <P>SOLUTION: The insulating film 40 is formed on a substrate 30 selected from a group containing a BT resin-based substrate and an epoxy resin-based substrate. On the insulating film, a copper wiring including a wiring 42 and a copper post are formed. To the exposed surfaces of the insulating film, the copper wiring, and the copper post provided on the semiconductor substrate; plasma processing is performed using nitride-based gas. A sealing part 44 covering and sealing the exposed surface is formed. <P>COPYRIGHT: (C)2007,JPO&INPIT |
