| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface-mounting semiconductor device which can be easily manufactured with few number of processes, while at the same time, maintaining a high heat dissipation properties. <P>SOLUTION: In manufacturing the semiconductor light-emitting device 1; a lead frame 4 mounted with a light-emitting element 2 is held between metal molds, and resin is injected into a space formed by the lead frame and the metal molds to form a case 3. Then a lead frame 5 on the light-emitting element mounted side and a lead frame 6 on the wire side, which are made projecting from the short side-side side face of the case 3, are bent along the side face and the bottom face of the case 3. The heat, generated by the light-emitting element 2, is transmitted from the mounting plane 5a of the light-emitting element mounted-side lead frame 5 to the side face 5b, and then is dissipated from the bottom face 5c to the substrate side. At the same time, the heat transmitted to a heat sink 7 is dissipated into the air. Since the heat sink 7 is formed over nearly the entire surface of the long side-side side faces of the case 3, a large amount of heat can be dissipated into the air from these faces. <P>COPYRIGHT: (C)2007,JPO&INPIT |
