| 摘要 |
A heat sink ( 10 ) includes a base ( 14 ) and a plurality of heat dissipating protuberances ( 12 ). The base includes a plurality of shielding walls ( 142 ) and at least one receiving space ( 140 ) for receiving at least one electronic component ( 24 ). The shielding walls define the receiving space. The heat dissipating protuberances extend up from the base, for dissipating heat generated by the electronic component. The heat sink not only protects the electronic component from EMI, but also effectively dissipates heat generated by the electronic component.
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