发明名称 IRIDIUM PLATING SOLUTION AND IRIDIUM PLATING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a practical and stable iridium plating solution capable of keeping high cathode current density and cathode current efficiency for a long period and obtaining an excellent coating film and an iridium plating method. SOLUTION: The iridium plating solution contains a soluble iridium salt containing halogen, alcohols and preferably at least one of sulfate, nitrate and a hydrohalogenic acid salt. The iridium plating method is an electroplating method for forming an iridium coating film using the iridium plating solution in which alcohols are added or alcohols, sulfate, nitrate and hydrohalogenic acid salt are added in a plating bath provided a diaphragm between an anode and a cathode. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007039778(A) 申请公布日期 2007.02.15
申请号 JP20050228109 申请日期 2005.08.05
申请人 NISSHIN KASEI KK 发明人 MATSUBARA YUKIO;OSAKA TAKASHI;KATO KEITARO
分类号 C25D3/50;C25D17/00 主分类号 C25D3/50
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