| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device of high packaging performance and a highly reliable electronic module, and to provide a process for manufacturing an electronic module. <P>SOLUTION: The semiconductor device comprises a semiconductor chip 10 having electrodes 14, a plurality of resin protrusions 20 formed on the surface of the semiconductor chip 10 where the electrodes 14 are formed, and interconnect lines 30 connected electrically with the electrodes 14 and formed on any resin protrusions. The resin protrusions 20 are formed to increase the height as they recede from the center of the surface of the semiconductor chip 10 where the electrodes 14 are formed. <P>COPYRIGHT: (C)2007,JPO&INPIT |
