UV-CURABLE AND THERMOSETTING EPOXY RESIN LACQUER FOR ELECTRONIC SUBASSEMBLIES IN HUMID SPACES

摘要

The invention relates to a UV-curable and thermosetting epoxy resin formulation comprising a) = 65 to = 95 percent by weight of an epoxy resin component, b) = 0.5 to = 10 percent by weight of a hydroxyl component, c) = 0.1 to = 3 percent by weight of a photoinitiator component, d) = 0.5 to = 3 percent by weight of a thermal initiator component, e) = 2 to = 30 percent by weight of a filler component, and f) = 0.1 to = 5 percent by weight of an additive component, the percentages being in relation to the total weight of the epoxy resin formulation.