| 摘要 |
<p>A resin composition for use in release film, including 95-99.99 weight % of an olefin type polymer, and 0.01-5 weight % of a polydimethylsiloxane having epoxy groups of which epoxy equivalent is not less than 500g/mol and not more than 50,000g/mol is prepared, and then the resultant resin composition is used.</p> |
