| 发明名称 |
SENSOR DEVICE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
<p>A sensor device (S1) includes a sensor chip (20) and a bonding wire (40) being fixed on a substrate (10). The sensor device (S1) is manufactured by using a binding material (30) made of an adhesive (32) containing a foaming agent (31 a) that evaporates upon exposure to heat. The binding material (30) reduces its elasticity after a wire bonding process because voids (31) being functional as a cushion are formed by evaporation of the foaming agent (31a). <IMAGE> <IMAGE> <IMAGE></p> |
| 申请公布号 |
KR100682625(B1) |
申请公布日期 |
2007.02.15 |
| 申请号 |
KR20050009188 |
申请日期 |
2005.02.01 |
| 申请人 |
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发明人 |
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| 分类号 |
G01P15/125;G01D11/24;G01P1/02;G01P15/08;H01L21/50;H01L21/58;H01L23/48;H01L29/84 |
主分类号 |
G01P15/125 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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