发明名称 FILM THICKNESS MEASUREMENT METHOD, AND SUBSTRATE TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To easily measure a film thickness of an oxide film in a short period of time. SOLUTION: This film thickness measuring method finds the film thickness of the oxide film of metal or alloy, or a thin film thereof, using only a phase difference▵measured ellipsometrically, based on a preliminarily prepared relation between the oxide film of metal or alloy, or the thin film thereof, and the phase difference▵measured ellipsometrically. This substrate treatment device has a film thickness measuring instrument for finding the film thickness of the oxide film of metal or alloy, or the thin film thereof, using only the phase difference▵measured ellipsometrically, based on the preliminarily prepared relation between the oxide film of metal or alloy, or the thin film thereof and the phase difference▵measured ellipsometrically. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007040930(A) 申请公布日期 2007.02.15
申请号 JP20050227977 申请日期 2005.08.05
申请人 EBARA CORP 发明人 SUZAKI AKIRA;SHIMA SHOHEI;FUKUNAGA YUKIO;TATEISHI HIDEKI;MINE JUNKO
分类号 G01B11/06;H01L21/66 主分类号 G01B11/06
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