发明名称 Pulsed magnetron sputtering deposition with preionization
摘要 The present invention relates to the deposition in a magnetron reactor ( 1 ) equipped with a magnetron cathode (MC) of at least one material on a substrate ( 11 a), according to which process said material is vaporized by magnetron sputtering, using a gas that is ionized in pulsed mode. To this effect and in order to favour the formation of high current pulses of short duration while avoiding the formation of electric arcs and while enabling an effective ionisation of the sputtered vapour, a preionization of the said gas prior to the application of the main voltage pulse on the magnetron cathode (MC) is carried out in order to generate current pulses (CP) whose decay time (T<SUB>d</SUB>), after cut-off of the main voltage pulse (VP) is shorter than 5 mus.
申请公布号 US2007034498(A1) 申请公布日期 2007.02.15
申请号 US20060525368 申请日期 2006.09.22
申请人 UNIVERSITE PARIS-SUD 发明人 GANCIU-PETCU MIHAI;HECQ MICHEL;DAUCHOT JEAN-PIERRE;KONSTANTINIDIS STEPHANOS;BRETAGNE JEAN;DE POUCQUES LUDOVIC;TOUZEAU MICHEL
分类号 C23C14/32;C23C14/00;C23C14/35;H01J37/34 主分类号 C23C14/32
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