发明名称 |
Method and apparatus for flip-chip bonding |
摘要 |
Provided are a laser flip-chip bonding method having high productivity and excellent bonding reliability and a flip-chip bonder employing the same. The flip-chip bonder includes: a bonding stage on which a substrate rests; a bonding head picking up a semiconductor chip and attaching the semiconductor chip to the substrate; and a semiconductor chip heating unit heating the semiconductor chip to a bonding temperature. The semiconductor chip heating unit includes: a laser light source; and a lens assembly refracting a laser beam emitted by the laser light source to a top surface of the semiconductor chip so that a central position of the laser beam varies across the top surface of the semiconductor chip.
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申请公布号 |
US2007037318(A1) |
申请公布日期 |
2007.02.15 |
申请号 |
US20050292042 |
申请日期 |
2005.12.01 |
申请人 |
SAMSUNG TECHWIN CO., LTD. |
发明人 |
KIM SANG-CHEOL |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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