| 摘要 |
A lead frame for semiconductor device has at least one bed frame capable of supporting a dual-pin-type chip, a plurality of suspension pin frames which extend from the bed frame in a first direction, and are disposed apart from each other in a second direction, and at least two beam frames which extend from the plurality of suspension pin frames in the second direction, and connect the plurality of suspension pin frames at both sides of the chip by sandwiching the chip. |
