| 摘要 |
<p>A transparent wafer (101), typically a glass wafer, is placed over a silicon wafer (100) having an integrated circuit with one or more optically active elements (106) provided thereon. The transparent wafer (101) is securely sealed to the silicon wafer (100) by a pattern of glass frit material (104) applied to one or both wafers (100, 101). The glass frit pattern (104) is screen printed on to the appropriate wafer (100, 101) and is arranged so as to surround the or each optically active element or elements (106) of each integrated circuit. The two wafers (100, 101) are aligned and brought together. The wafers (100, 101) are then raised in temperature to cause the glass frit material (105) to reflow and seal the wafers together. In this manner, the glass frit (105) seals the gap between the two wafers (100, 101).</p> |
