| 摘要 |
PROBLEM TO BE SOLVED: To provide a reactive hot melt adhesive which has improved flexibility with a low specific weight, while maintaining the adhesion and heat resistance equivalent to those of conventional reactive hot melt adhesives. SOLUTION: The reactive hot melt adhesive comprises a moisture-curable urethane polymer with an isocyanate terminal and a hollow filler. Especially, the hollow filler is an organic hollow filler comprising a vinyl monomer having a specific functional group as a required constituting element for a shell polymer. COPYRIGHT: (C)2007,JPO&INPIT
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