| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a painted semiconductor device which can form a high-accuracy micropattern by applying a printing method, without making the manufacturing method complex, thereby enabling high integration of element configuration. <P>SOLUTION: A concave pattern 1a is formed on the front surface of a substrate 1 through embossing which presses a stamper 3 having a concave-convex form. Next, a source/drain electrode 5 is formed on both the sides of the concave pattern 1a. In the concave pattern 1a, a painted material made of semiconductor material is supplied by printing, and an active layer 7a is formed by making this solidified. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
