| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection method of a semiconductor wafer which can make a very accurate screening of failures which are likely to occur in an initial failure period. SOLUTION: The inspection method of a semiconductor wafer includes a process of preparing a wafer formed with a chip region which will become a semiconductor chip, a first probe test for inspecting the wafer by probing, a process of pressing the electrode of the wafer by a pressurization member having a flat plane, and a second probe test for inspecting the wafer by probing. COPYRIGHT: (C)2007,JPO&INPIT
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