| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in transparency, heat resistance and heat discoloration resistance and having preferable coating property, developing property and storage stability. <P>SOLUTION: The resin composition contains a copolymer [A] containing hydroxyphenyl (meth)acrylate (a1) and an epoxy group-containing unsaturated compound (a2) as polymer components, and a quinonediazide group-containing compound [B]. <P>COPYRIGHT: (C)2007,JPO&INPIT |
