Epoxy resin composition for packaging a semiconductor device, method of making the same, and semiconductor device using the same

摘要

An epoxy resin composition, and a method of making the same, includes an epoxy resin and a curing agent, the epoxy resin composition also includes inorganic fillers, curing accelerators, and modified silicone oils. The epoxy resin is a modified epoxy resin prepared by glycidyl etherification of a mixture of a novolac type phenolic compound having a biphenyl derivative in the molecule and a 4,4'-dihydroxy biphenyl compound, and the curing agent is a mixture of a polyaromatic curing agent and a polyfunctional curing agent.