发明名称 |
RESIN COMPOSITION FOR MOLDING MATERIAL AND MOLDING MATERIAL |
摘要 |
PROBLEM TO BE SOLVED: To provide a molding material having good handling properties, which is obtained by allowing a mild reaction of bis(2-oxazoline) compound with an aromatic amine to temporarily keep a resin composition in a partially cured state. SOLUTION: The resin composition for a molding material comprises a preliminary reaction product between a dicyclopentadiene-type epoxy monomer and an excess of aromatic amine acting as a curing agent thereof, a bis(2-oxazoline) compound, and a catalyst for starting the reaction of the aromatic amine with the bis(2-oxazoline) compound. The molding material is obtained by causing the resin composition to be retained in a reinforcing fiber substrate and heating and drying the composite to a partially cured state. COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2007031486(A) |
申请公布日期 |
2007.02.08 |
申请号 |
JP20050213072 |
申请日期 |
2005.07.22 |
申请人 |
SHIN KOBE ELECTRIC MACH CO LTD |
发明人 |
ISHIKAWA TOMOKAZU;OZAWA MASAYA;HASHIMOTO YASUYUKI;KOBAYASHI NAOMI;HATTORI ISAMU;SAWAI SHOJI |
分类号 |
C08G69/40;C08J5/04;C08L77/00 |
主分类号 |
C08G69/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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